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111 2 a| International Workshop on Stress-Induced Phenomena in Metallizationn| (7th :d| 2004 :c| Austin, Tex.)?| UNAUTHORIZED;

245 10 a| Stress-induced phenomena in metallizationh| [electronic resource] :b| Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004 /c| editors, Paul S. Ho ... [et al.].;

246 3 a| Stress induced phenomena in metallization;

260 a| Melville, N.Y. :b| American Institute of Physics,;

300 a| vii, 272 p. :b| ill. ;c| 25 cm.;

490 1 a| AIP conference proceedings,x| 0094-243X ;v| v. 741;

500 a| "Held at the University of Texas at Austin"--Pref.;

504 a| Includes bibliographical references and indexes.;

505 0 a| Fracture and reliability for low k dielectrics -- Electromigration -- Thermal stresses and void formation.;

506 a| Available only to authorized users.;

530 a| Also available via the World Wide Web.;

538 a| Mode of access: World Wide Web;

650 0 a| Semiconductorsx| Defectsv| Congresses.=| ^A654219;

650 0 a| Integrated circuitsx| Defectsv| Congresses.=| ^A42814;

650 0 a| Interconnects (Integrated circuit technology)x| Defectsv| Congresses.=| ^A872060;

650 0 a| Dielectric filmsx| Defectsv| Congresses.=| ^A695776;

650 0 a| Metallic filmsx| Defectsv| Congresses.=| ^A462329;

650 0 a| Thin film devicesx| Defectsv| Congresses.=| ^A125060;

650 0 a| Copperx| Electric propertiesv| Congresses.=| ^A5924;

650 0 a| Metallizingv| Congresses.=| ^A1022611;

650 0 a| Electrodiffusionv| Congresses.=| ^A56304;

650 0 a| Damasceningv| Congresses.=| ^A208849;

655 0 a| Electronic books.=| ^A491897;

700 1 a| Ho, P. S.?| UNAUTHORIZED;

830 0 a| AIP conference proceedings ;v| no. 741.=| ^A24766;

856 40 z| Full text available from AIP Conference Proceedingsu| https://go.openathens.net/redirector/ecu.edu?url=https%3A%2F%2Fpubs.aip.org%2Faip%2Facp%2Fissue%2F741%2F1;

947 a| (OCoLC)ocm57340844;

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Stress-induced phenomena in metallization Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004 / editors, Paul S. Ho ... [et al.].

Author/creator	International Workshop on Stress-Induced Phenomena in Metallization
Other author	Ho, P. S.
Format	Electronic
Publication Info	Melville, N.Y. : American Institute of Physics,
Description	vii, 272 p. : ill. ; 25 cm.
Supplemental Content	Full text available from AIP Conference Proceedings
Subjects	Semiconductors--Defects. --Congresses. Integrated circuits--Defects. --Congresses. Interconnects (Integrated circuit technology)--Defects. --Congresses. Dielectric films--Defects. --Congresses. Metallic films--Defects. --Congresses. Thin film devices--Defects. --Congresses. Copper--Electric properties. --Congresses. Metallizing--Congresses. Electrodiffusion--Congresses. Damascening--Congresses.

Variant title	Stress induced phenomena in metallization
Series	AIP conference proceedings, 0094-243X ; v. 741 AIP conference proceedings ; no. 741. ^A24766
Contents	Fracture and reliability for low k dielectrics -- Electromigration -- Thermal stresses and void formation.
General note	"Held at the University of Texas at Austin"--Pref.
Bibliography note	Includes bibliographical references and indexes.
Access restriction	Available only to authorized users.
Other forms	Also available via the World Wide Web.
Technical details	Mode of access: World Wide Web
Genre/form	Electronic books.
LCCN	2004116273
ISBN	0735402256

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Stress-induced phenomena in metallization Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004 / editors, Paul S. Ho ... [et al.].

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