Flip chip hybridization using indium bump technology at ARL / Kimberley A. Olver.
| Author/creator | Olver, Kimberley A. author. |
| Other author | U.S. Army Research Laboratory, issuing body. |
| Format | Electronic |
| Publication | Adelphi. MD : Army Research Laboratory, [2007] |
| Description | 1 online resource (iv, 8 pages) : color illustrations |
| Supplemental Content | https://purl.fdlp.gov/GPO/gpo59641 |
| Subjects |
| Variant title | Flip chip hybridization using indium bump technology at Army Research Laboratory |
| General note | Title from title screen (viewed on Aug. 4, 2015). |
| General note | "July 2007." |
| General note | "ARL-TN-283." |
| Bibliography note | Includes bibliographical references (page 5). |
| Technical rpt# | ARL-TN-283 |
| GPO item number | 0324-A-03 (online) |
| Govt. docs number | D 101.133/2:283 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Electronic Resources | Access Content Online | ✔ Available |