Fundamentals of modern manufacturing : materials, processes, and systems / Mikell P. Groover.

Author/creator Groover, Mikell P., 1939-
Format Book
Edition5th ed.
Publication InfoHoboken, NJ : John Wiley & Sons, Inc., ©2013.
Descriptionxv, 1101 pages : illustrations (some color) ; 27 cm
Subjects
Production engineering.
Manufacturing processes.

Contents Machine generated contents note: 1.Introduction and Overview of Manufacturing -- 1.1.What Is Manufacturing? -- 1.2.Materials in Manufacturing -- 1.3.Manufacturing Processes -- 1.4.Production Systems -- 1.5.Manufacturing Economics -- 1.6.Recent Developments in Manufacturing -- pt. I Material Properties and Product Attributes -- 2.The Nature of Materials -- 2.1.Atomic Structure and the Elements -- 2.2.Bonding between Atoms and Molecules -- 2.3.Crystalline Structures -- 2.4.Noncrystalline (Amorphous) Structures -- 2.5.Engineering Materials -- 3.Mechanical Properties of Materials -- 3.1.Stress-Strain Relationships -- 3.2.Hardness -- 3.3.Effect of Temperature on Properties -- 3.4.Fluid Properties -- 3.5.Viscoelastic Behavior of Polymers -- 4.Physical Properties of Materials -- 4.1.Volumetric and Melting Properties -- 4.2.Thermal Properties -- 4.3.Mass Diffusion -- 4.4.Electrical Properties -- 4.5.Electrochemical Processes -- 5.Dimensions, Surfaces, and Their Measurement -- 5.1.Dimensions, Tolerances, and Related Attributes -- 5.2.Measuring Instruments and Gages -- 5.3.Surfaces -- 5.4.Measurement of Surfaces -- 5.5.Effect of Manufacturing Processes -- pt. II Engineering Materials -- 6.Metals -- 6.1.Alloys and Phase Diagrams -- 6.2.Ferrous Metals -- 6.3.Nonferrous Metals -- 6.4.Superalloys -- 7.Ceramics -- 7.1.Structure and Properties of Ceramics -- 7.2.Traditional Ceramics -- 7.3.New Ceramics -- 7.4.Glass -- 7.5.Some Important Elements Related to Ceramics -- 8.Polymers -- 8.1.Fundamentals of Polymer Science and Technology -- 8.2.Thermoplastic Polymers -- 8.3.Thermosetting Polymers -- 8.4.Elastomers -- 8.5.Polymer Recycling and Biodegradability -- 9.Composite Materials -- 9.1.Technology and Classification of Composite Materials -- 9.2.Metal Matrix Composites -- 9.3.Ceramic Matrix Composites -- 9.4.Polymer Matrix Composites -- pt. III Solidification Processes -- 10.Fundamentals of Metal Casting -- 10.1.Overview of Casting Technology -- 10.2.Heating and Pouring -- 10.3.Solidification and Cooling -- 11.Metal Casting Processes -- 11.1.Sand Casting -- 11.2.Other Expendable-Mold Casting Processes -- 11.3.Permanent-Mold Casting Processes -- 11.4.Foundry Practice -- 11.5.Casting Quality -- 11.6.Metals for Casting -- 11.7.Product Design Considerations -- 12.Glassworking -- 12.1.Raw Materials Preparation and Melting -- 12.2.Shaping Processes in Glassworking -- 12.3.Heat Treatment and Finishing -- 12.4.Product Design Considerations -- 13.Shaping Processes for Plastics -- 13.1.Properties of Polymer Melts -- 13.2.Extrusion -- 13.3.Production of Sheet and Film -- 13.4.Fiber and Filament Production (Spinning) -- 13.5.Coating Processes -- 13.6.Injection Molding -- 13.7.Compression and Transfer Molding -- 13.8.Blow Molding and Rotational Molding -- 13.9.Thermoforming -- 13.10.Casting -- 13.11.Polymer Foam Processing and Forming -- 13.12.Product Design Considerations -- 14.Processing of Polymer Matrix Composites and Rubber -- 14.1.Overview of PMC Processing -- 14.2.Open Mold Processes -- 14.3.Closed Mold Processes -- 14.4.Other PMC Shaping Processes -- 14.5.Rubber Processing and Shaping -- 14.6.Manufacture of Tires and Other Rubber Products -- pt. IV Particulate Processing of Metals and Ceramics -- 15.Powder Metallurgy -- 15.1.Characterization of Engineering Powders -- 15.2.Production of Metallic Powders -- 15.3.Conventional Pressing and Sintering -- 15.4.Alternative Pressing and Sintering Techniques -- 15.5.Materials and Products for Powder Metallurgy -- 15.6.Design Considerations in Powder Metallurgy -- 16.Processing of Ceramics and Cermets -- 16.1.Processing of Traditional Ceramics -- 16.2.Processing of New Ceramics -- 16.3.Processing of Cermets -- 16.4.Product Design Considerations -- pt. V Metal Forming and Sheet Metalworking -- 17.Fundamentals of Metal Forming -- 17.1.Overview of Metal Forming -- 17.2.Material Behavior in Metal Forming -- 17.3.Temperature in Metal Forming -- 17.4.Strain Rate Sensitivity -- 17.5.Friction and Lubrication in Metal
Contents Forming -- 18.Bulk Deformation Processes in Metalworking -- 18.1.Rolling -- 18.2.Other Deformation Processes Related to Rolling -- 18.3.Forging -- 18.4.Other Deformation Processes Related to Forging -- 18.5.Extrusion -- 18.6.Wire and Bar Drawing -- 19.Sheet Metalworking -- 19.1.Cutting Operations -- 19.2.Bending Operations -- 19.3.Drawing -- 19.4.Other Sheet-Metal-Forming Operations -- 19.5.Dies and Presses for Sheet-Metal Processes -- 19.6.Sheet-Metal Operations Not Performed on Presses -- 19.7.Bending of Tube Stock -- pt. VI Material Removal Processes -- 20.Theory of Metal Machining -- 20.1.Overview of Machining Technology -- 20.2.Theory of Chip Formation in Metal Machining -- 20.3.Force Relationships and the Merchant Equation -- 20.4.Power and Energy Relationships in Machining -- 20.5.Cutting Temperature -- 21.Machining Operations and Machine Tools -- 21.1.Machining and Part Geometry -- 21.2.Turning and Related Operations -- 21.3.Drilling and Related Operations -- 21.4.Milling -- 21.5.Machining Centers and Turning Centers -- 21.6.Other Machining Operations -- 21.7.Machining Operations for Special Geometries -- 21.8.High-Speed Machining -- 22.Cutting-Tool Technology -- 22.1.Tool Life -- 22.2.Tool Materials -- 22.3.Tool Geometry -- 22.4.Cutting Fluids -- 23.Economic and Product Design Considerations in Machining -- 23.1.Machinability -- 23.2.Tolerances and Surface Finish -- 23.3.Selection of Cutting Conditions -- 23.4.Product Design Considerations in Machining -- 24.Grinding and Other Abrasive Processes -- 24.1.Grinding -- 24.2.Related Abrasive Processes -- 25.Nontraditional Machining and Thermal Cutting Processes -- 25.1.Mechanical Energy Processes -- 25.2.Electrochemical Machining Processes -- 25.3.Thermal Energy Processes -- 25.4.Chemical Machining -- 25.5.Application Considerations -- pt. VII Property Enhancing and Surface Processing Operations -- 26.Heat Treatment of Metals -- 26.1.Annealing -- 26.2.Martensite Formation in Steel -- 26.3.Precipitation Hardening -- 26.4.Surface Hardening -- 26.5.Heat Treatment Methods and Facilities -- 27.Surface Processing Operations -- 27.1.Industrial Cleaning Processes -- 27.2.Diffusion and Ion Implantation -- 27.3.Plating and Related Processes -- 27.4.Conversion Coating -- 27.5.Vapor Deposition Processes -- 27.6.Organic Coatings -- 27.7.Porcelain Enameling and Other Ceramic Coatings -- 27.8.Thermal and Mechanical Coating Processes -- pt. VIII Joining and Assembly Processes -- 28.Fundamentals of Welding -- 28.1.Overview of Welding Technology -- 28.2.The Weld Joint -- 28.3.Physics of Welding -- 28.4.Features of a Fusion-Welded Joint -- 29.Welding Processes -- 29.1.Arc Welding -- 29.2.Resistance Welding -- 29.3.Oxyfuel Gas Welding -- 29.4.Other Fusion-Welding Processes -- 29.5.Solid-State Welding -- 29.6.Weld Quality -- 29.7.Weldability -- 29.8.Design Considerations in Welding -- 30.Brazing, Soldering, and Adhesive Bonding -- 30.1.Brazing -- 30.2.Soldering -- 30.3.Adhesive Bonding -- 31.Mechanical Assembly -- 31.1.Threaded Fasteners -- 31.2.Rivets and Eyelets -- 31.3.Assembly Methods Based on Interference Fits -- 31.4.Other Mechanical Fastening Methods -- 31.5.Molding Inserts and Integral Fasteners -- 31.6.Design for Assembly -- pt. IX Special Processing and Assembly Technologies -- 32.Rapid Prototyping and Additive Manufacturing -- 32.1.Fundamentals of Rapid Prototyping and Additive Manufacturing -- 32.2.Additive Manufacturing Processes -- 32.3.Cycle Time and Cost Analysis -- 32.4.Additive Manufacturing Applications -- 33.Processing of Integrated Circuits -- 33.1.Overview of IC Processing -- 33.2.Silicon Processing -- 33.3.Lithography -- 33.4.Layer Processes Used in IC Fabrication -- 33.5.Integrating the Fabrication Steps -- 33.6.IC Packaging -- 33.7.Yields in IC Processing -- 34.Electronics Assembly and Packaging -- 34.1.Electronics Packaging -- 34.2.Printed Circuit Boards -- 34.3.Printed Circuit Board Assembly -- 34.4.Electrical Connector Technology -- 35.Microfabrication Technologies -- 35.1.Microsystem Products -- 35.2.Microfabrication Processes -- 36.Nanofabrication Technologies -- 36.1.Nanotechnology Products and Applications -- 36.2.Introduction to Nanoscience -- 36.3.Nanofabrication Processes -- pt. X Manufacturing Systems -- 37.Automation Technologies for Manufacturing Systems -- 37.1.Automation Fundamentals -- 37.2.Hardware for Automation -- 37.3.Computer Numerical Control -- 37.4.Industrial Robotics -- 38.Integrated Manufacturing Systems -- 38.1.Material Handling -- 38.2.Fundamentals of Production Lines -- 38.3.Manual Assembly Lines -- 38.4.Automated Production Lines -- 38.5.Cellular Manufacturing -- 38.6.Flexible Manufacturing Systems and Cells -- 38.7.Computer Integrated Manufacturing -- pt. XI Manufacturing Support Systems -- 39.Process Planning and Production Control -- 39.1.Process Planning -- 39.2.Other Manufacturing Engineering Functions -- 39.3.Production Planning and Control -- 39.4.Just-In-Time Delivery Systems -- 39.5.Lean Production -- 40.Quality Control and Inspection -- 40.1.Product Quality -- 40.2.Process Capability and Tolerances -- 40.3.Statistical Process Control -- 40.4.Quality Programs in Manufacturing -- 40.5.Inspection Principles -- 40.6.Modem Inspection Technologies.
Bibliography noteIncludes bibliographical references and index.
LCCN 2012028597
ISBN9781118231463 (hbk. : alk. paper)
ISBN1118231465 (hbk. : alk. paper)

Availability

Library Location Call Number Status Item Actions
Joyner General Stacks TS183 .G78 2013 ✔ Available Place Hold