Low temperature creep of hot-extruded near-stoichiometric NiTi shape memory alloy / S.V. Raj and R.D. Noebe.

Author/creator Raj, Sai V. author.
Other author Noebe, R. D., author.
Other author Fundamental Aeronautics Program (U.S.), sponsoring body.
Other author NASA Glenn Research Center, issuing body.
Format Electronic
PublicationCleveland, Ohio : National Aeronautics and Space Administration, Glenn Research Center, [2013]
Description1 online resource (2 volumes) : illustrations.
Supplemental Contenthttps://purl.fdlp.gov/GPO/gpo40560

SeriesNASA/TM ; 2013-217888
NASA technical memorandum 217888. ^A467613
Contents pt. I. Isothermal creep. -- pt. II. Effect of thermal cycling.
General noteTitle from title screen (viewed Nov. 13, 2013).
General note"June 2013."
General noteCRDP Program record.
Bibliography noteIncludes bibliographical references.
Funding informationE-18699-1 E-18699-2
Funding informationSponsored by the Fundamental Aeronautics Program at the NASA Glenn Research Center 561581.02.08.47.05.04
GPO item number0830-D (online)
Govt. docs number NAS 1.15:2013-217888/PTS.1-2

Availability

Library Location Call Number Status Item Actions
Electronic Resources Access Content Online ✔ Available