Solder joint rework simulation analysis / by the Electronics Manufacturing Productivity Facility.

Other author Electronics Manufacturing Productivity Facility (U.S.)
Format Book
Publication InfoRidgecrest, Calif. : The Facility, [1990]
Description39 pages : illustrations (some color) ; 28 cm.
Subjects

SeriesEMPF TB ; 0019
EMPF TB ; 0019. ^A1087998
General noteShipping list no.: 91-099-P.
Bibliography noteIncludes bibliographical references (p. 9).
Issued in other formOnline version: Solder joint rework simulation analysis. Ridgecrest, Calif. : The Facility, [1990]
GPO item number370
Govt. docs number D 201.2:So 4

Availability

Library Location Call Number Status Item Actions
Joyner Fed Docs Stacks D 201.2:SO 4 ✔ Available Place Hold