Solder joint rework simulation analysis / by the Electronics Manufacturing Productivity Facility.
| Other author | Electronics Manufacturing Productivity Facility (U.S.) |
| Format | Book |
| Publication Info | Ridgecrest, Calif. : The Facility, [1990] |
| Description | 39 pages : illustrations (some color) ; 28 cm. |
| Subjects |
| Series | EMPF TB ; 0019 EMPF TB ; 0019. ^A1087998 |
| General note | Shipping list no.: 91-099-P. |
| Bibliography note | Includes bibliographical references (p. 9). |
| Issued in other form | Online version: Solder joint rework simulation analysis. Ridgecrest, Calif. : The Facility, [1990] |
| GPO item number | 370 |
| Govt. docs number | D 201.2:So 4 |
Availability
| Library | Location | Call Number | Status | Item Actions |
|---|---|---|---|---|
| Joyner | Fed Docs Stacks | D 201.2:SO 4 | ✔ Available | Place Hold |