Tools

LEADER 02035cam a2200493Ka 4500

001 ocn233027862;

003 OCoLC;

005 20141212004643.0;

008 080702s1983 cau b f000 0 eng d;

035 a| (Sirsi) o233027862;

035 a| (OCoLC)233027862;

040 a| GPOc| GPOd| UtOrBLW;

049 a| ERE$;

074 a| 0830-D (MF);

074 a| 0830-D (online);

086 0 a| NAS 1.15:85861;

100 1 a| Salerno, Louis J.=| ^A431961;

245 10 a| Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures /c| Louis J. Salerno, P. Kittel, and A. L. Spivak.;

260 a| Moffet Field, Calif. :b| National Aeronautics and Space Administration, Ames Research Center,c| [1983];

300 a| 1 volume.;

336 a| text2| rdacontent;

337 a| microform2| rdamedia;

338 a| microfiche2| rdacarrier;

490 1 a| NASA technical memorandum ;v| 85861;

530 a| Also available via Internet from the NTRS web site. Address as of 07/01/08: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19840004741%5F1984004741.pdf ; current access is available via PURL.;

650 0 a| Copperx| Thermal conductivity.=| ^A784096;

650 0 a| Liquid helium.=| ^A25071;

650 7 a| Conductive heat transfer.2| nasat;

650 7 a| Copper.2| nasat;

650 7 a| Electric contacts.2| nasat;

650 7 a| Low temperatures.2| nasat;

650 7 a| Surface roughness effects.2| nasat;

650 7 a| Thermal resistance.2| nasat;

700 1 a| Kittel, Peter.=| ^A431962;

700 1 a| Spivak, Alan L.=| ^A444463;

710 2 a| Ames Research Center.=| ^A101004;

830 0 a| NASA technical memorandumv| 85861.=| ^A467613;

856 41 u| https://purl.fdlp.gov/GPO/LPS96095;

994 a| C0b| ERE;

998 a| 1393374;

998 a| u1393374;

596 a| 1;

999 a| NAS 1.15:85861w| SUDOCc| 1i| MQ2578609d| 8/12/2008l| JDOMIm| JOYNERr| Ys| Yt| JDOFMIu| 8/12/2008x| MICROFORMz| JFEDDOCSo| .STAFF. 0;

Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures / Louis J. Salerno, P. Kittel, and A. L. Spivak.

Author/creator	Salerno, Louis J.
Other author	Kittel, Peter.
Other author	Spivak, Alan L.
Other author	Ames Research Center.
Format	Book
Publication Info	Moffet Field, Calif. : National Aeronautics and Space Administration, Ames Research Center, [1983]
Description	1 volume.
Supplemental Content	https://purl.fdlp.gov/GPO/LPS96095
Subjects	Copper--Thermal conductivity. Liquid helium.

Series	NASA technical memorandum ; 85861 NASA technical memorandum 85861. ^A467613
Other forms	Also available via Internet from the NTRS web site. Address as of 07/01/08: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19840004741%5F1984004741.pdf ; current access is available via PURL.
Reproduction note	Joyner- Microfiche. [Washington, D.C. : National Aeronautics and Space Administration], 1984. 1 microfiche.
GPO item number	0830-D (MF)
GPO item number	0830-D (online)
Govt. docs number	NAS 1.15:85861

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Library	Location	Call Number	Status	Item Actions
Joyner	Microforms B300	NAS 1.15:85861	✔ Available

Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures / Louis J. Salerno, P. Kittel, and A. L. Spivak.

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