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Olver, Kimberley A.
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A new technique for wirebonding using indium spheres
by
Olver, Kimberley A.
2010
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Electronic
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A new procedure for the application and curing of polyimide film on gold-coated silcon wafers
by
Olver, Kimberley A.
2009
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Electronic
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Flip chip hybridization using indium bump technology at ARL
by
Olver, Kimberley A.
2007
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