Components, Packaging, & Manufacturing Technology Society - ECU Libraries Catalog

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Cover image for 2003 22nd International Conference on Thermoelectrics

2003 22nd International Conference on Thermoelectrics

by IEEE Components, Packaging & Manufacturing Technology Society Staff
2003
Format: Electronic

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Cover image for IWIPP proceedings

IWIPP proceedings

by IEEE International Workshop on Integrated Power Packaging
1998
Format: Electronic

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Cover image for Seventh biennial IEEE Nonvolatile Memory Technology Conference

Seventh biennial IEEE Nonvolatile Memory Technology Conference

by IEEE International Nonvolatile Memory Technology Conference
1998
Format: Electronic

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Cover image for IEMT/IMC Symposium

IEMT/IMC Symposium

by IEMT/IMC Symposium
1997
Format: Electronic

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Cover image for 2001 20th International Conference on Thermoeletrics

2001 20th International Conference on Thermoeletrics

by IEEE Components, Packaging and Manufacturing Technology Society Staff
2001
Format: Electronic

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Cover image for 2001 IEEE 47th Holm Conference on Electrical Contacts

2001 IEEE 47th Holm Conference on Electrical Contacts

by IEEE, Components, Packaging and Manufacturing Technology Society Staff
2001
Format: Electronic

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Cover image for 2001 International Symposium on Electronic Materials and Packaging

2001 International Symposium on Electronic Materials and Packaging

by IEEE, Components, Packaging and Manufacturing Technology Society Staff
2001
Format: Electronic

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Cover image for 2001 Proceedings 51st Electronic Components and Technology Conference

2001 Proceedings 51st Electronic Components and Technology Conference

by IEEE Components, Packaging and Manufacturing Technology Society Staff
2001
Format: Electronic

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Cover image for 2002 8th International Advanced Packaging Materials Symposium

2002 8th International Advanced Packaging Materials Symposium

by IEEE, Components, Packaging and Manufacturing Technology Society Staff
2002
Format: Electronic

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Cover image for 2002 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2002 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

by IEEE, Components, Packaging and Manufacturing Technology Society Staff
2002
Format: Electronic

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