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Cover image for Interlayer Dielectrics for Semiconductor Technologies

Interlayer Dielectrics for Semiconductor Technologies

by Muraka, Shyam P.
2003
Format: Electronic

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Cover image for Interlayer triplet energy transfer in Dion-Jacobson 2d perovskites containing naphthalene diammonium cations

Interlayer triplet energy transfer in Dion-Jacobson 2d perovskites containing naphthalene diammonium cations

by Lin, YunHui
2021
Format: Electronic

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Cover image for Viscoelastic characterization of aliphatic polyurethane interlayers

Viscoelastic characterization of aliphatic polyurethane interlayers

2007
Format: Electronic

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Cover image for Advanced technologies for next generation integrated circuits

Advanced technologies for next generation integrated circuits

2020
Format: Electronic

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Cover image for Teaching clay science

Teaching clay science

2002
Format: Book

Location	Call #	Status
Joyner - General Stacks	QE389.625 .T42 2002	✔ Available

Cover image for Free-edge delamination

Free-edge delamination

by Murthy, P. L. N.
1987
Format: Microform

Location	Call #	Status
Joyner - Microforms B300	NAS 1.15:100238	✔ Available

Cover image for Free-edge delamination

Free-edge delamination

by Murthy, P. L. N.
1987
Format: Electronic

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Cover image for Failure mechanisms of laminates transversely loaded by bolt push-through

Failure mechanisms of laminates transversely loaded by bolt push-through

by Waters, William Allen
1985
Format: Microform

Location	Call #	Status
Joyner - Microforms B300	NAS 1.15:87603	✔ Available

Cover image for 3D concrete printing technology

3D concrete printing technology

2019
Format: Electronic

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Cover image for Functional nanostructured interfaces for environmental and biomedical applications

Functional nanostructured interfaces for environmental and biomedical applications

2019
Format: Electronic

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