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Cover image for Power electronics materials and bonded interfaces - reliability and lifetime

Power electronics materials and bonded interfaces - reliability and lifetime

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Cover image for Bonded interfaces for high-temperature power electronics

Bonded interfaces for high-temperature power electronics

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Cover image for Power electronics materials and bonded interfaces - reliability and lifetime

Power electronics materials and bonded interfaces - reliability and lifetime

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Cover image for Investigation of thermal interface materials using phase-sensitive transient thermoreflectance technique

Investigation of thermal interface materials using phase-sensitive transient thermoreflectance technique

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Cover image for Advanced power electronics designs - reliability and prognostics

Advanced power electronics designs - reliability and prognostics

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Cover image for Thermal performance and reliability of bonded interfaces for power electronics packaging applications

Thermal performance and reliability of bonded interfaces for power electronics packaging applications

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Cover image for Performance and reliability of bonded interfaces for high-temperature packaging

Performance and reliability of bonded interfaces for high-temperature packaging

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Cover image for Performance and reliability of bonded interfaces for high-temperature packaging

Performance and reliability of bonded interfaces for high-temperature packaging

  • 2018
  • Format: Electronic
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Cover image for Performance and reliability of bonded interfaces for high-temperature packaging

Performance and reliability of bonded interfaces for high-temperature packaging

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Cover image for Thermal performance and reliability characterization of bonded interface materials (BIMs)

Thermal performance and reliability characterization of bonded interface materials (BIMs)

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