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Cover image for Polyimides--thermally stable polymers

Polyimides--thermally stable polymers

  • 1987
  • Format: Book
Location Call # Status
Joyner - General Stacks TP1180.P66 P5813 1987 ✔ Available
Cover image for Charge transfer complexes of certain aromatic polyimides

Charge transfer complexes of certain aromatic polyimides

  • 1985
  • Format: Microform
Location Call # Status
Joyner - Microforms B300 NAS 1.15:77974 ✔ Available
Cover image for Effects of a noncoplanar biphenyldiamine on the processing and properties of addition polyimides

Effects of a noncoplanar biphenyldiamine on the processing and properties of addition polyimides

Location Call # Status
Joyner - Microforms B300 NAS 1.15:105383 ✔ Available
Cover image for Computed structures of polyimides model compounds

Computed structures of polyimides model compounds

  • by Tai, H.
  • 1990
  • Format: Microform
Location
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Cover image for A comparison of fiber effects on polymer matrix composite oxidation

A comparison of fiber effects on polymer matrix composite oxidation

Location Call # Status
Joyner - Microforms B300 NAS 1.15:104416 ✔ Available
Cover image for A solvent resistant copolyimide

A solvent resistant copolyimide

  • 1994
  • Format: Electronic
Location
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Cover image for Imidic polymers and green polymer chemistry

Imidic polymers and green polymer chemistry

  • 2021
  • First edition
  • Format: Electronic
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Cover image for A study of physical properties of ODPA-p-PDA polyimide films

A study of physical properties of ODPA-p-PDA polyimide films

Location Call # Status
Joyner - Microforms B300 NAS 1.15:102625 ✔ Available
Cover image for Phenylethynyl terminated imide oligomers

Phenylethynyl terminated imide oligomers

  • 1994
  • Format: Electronic
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Cover image for A process for preparing an assembly of an article and a polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature

A process for preparing an assembly of an article and a polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature

Location
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