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Cover image for Thermomechanical fatigue behavior of materials

Thermomechanical fatigue behavior of materials

  • 1996
  • Format: Electronic
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Cover image for High temperature tension-compression fatigue behavior of a tungsten copper composite

High temperature tension-compression fatigue behavior of a tungsten copper composite

Location Call # Status
Joyner - Microforms B300 NAS 1.15:104370 ✔ Available
Cover image for Current activities in standardization of high-temperature, low-cycle-fatigue testing techniques in the United States

Current activities in standardization of high-temperature, low-cycle-fatigue testing techniques in the United States

Location Call # Status
Joyner - Microforms B300 NAS 1.15:103675 ✔ Available
Cover image for High temperature fatigue behavior of tungsten copper composites

High temperature fatigue behavior of tungsten copper composites

Location Call # Status
Joyner - Microforms B300 NAS 1.15:102404 ✔ Available
Cover image for Characterization of failure processes in tungsten copper composites under fatigue loading conditions

Characterization of failure processes in tungsten copper composites under fatigue loading conditions

Location Call # Status
Joyner - Microforms B300 NAS 1.15:102371 ✔ Available