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Cover image for High Temperature Miniature Specimen Test Methods

High Temperature Miniature Specimen Test Methods

by Sun, Wei
2024
First edition
Format: Electronic

Location
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Cover image for Power system control under cascading failures

Power system control under cascading failures

by Sun, Kai, 1976-
2018
Format: Electronic

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Cover image for Applied creep mechanics

Applied creep mechanics

by Hyde, Thomas H.
2014
Format: Book

Location	Call #	Status
Joyner - General Stacks	TA418.22 .H94 2014	✔ Available

Cover image for Biofabrication

Biofabrication

2013
Format: Electronic

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Cover image for Homogenization modeling for mechanical properties of composite conductor with cooling channel

Homogenization modeling for mechanical properties of composite conductor with cooling channel

by Sun, Wei
2002
Format: Electronic

Location
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Cover image for Workshops on Electronic Commerce and Web-based Applications ; Middleware

Workshops on Electronic Commerce and Web-based Applications ; Middleware

by International Conference on Distributed Computing Systems
1999
Format: Electronic

Location
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