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Cover image for Power electronics materials and bonded interfaces - reliability and lifetime

Power electronics materials and bonded interfaces - reliability and lifetime

by Paret, Paul
2021
Format: Electronic

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Cover image for Bonded interfaces for high-temperature power electronics

Bonded interfaces for high-temperature power electronics

by Paret, Paul
2021
Format: Electronic

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Cover image for Thermal and mechanical design of a high-voltage power electronics package

Thermal and mechanical design of a high-voltage power electronics package

by Paret, Paul
2021
Format: Electronic

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Cover image for Parametric design study of a power electronics package

Parametric design study of a power electronics package

by Paret, Paul
2020
Format: Electronic

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Cover image for Dielectrics for power electronics applications

Dielectrics for power electronics applications

by Paret, Paul
2020
Format: Electronic

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Cover image for Power electronics materials and bonded interfaces - reliability and lifetime

Power electronics materials and bonded interfaces - reliability and lifetime

by Paret, Paul
2020
Format: Electronic

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Cover image for Thermal and thermomechanical modeling to design a gallium oxide power electronics package

Thermal and thermomechanical modeling to design a gallium oxide power electronics package

by Paret, Paul
2019
Format: Electronic

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Cover image for Performance and reliability of bonded interfaces for high-temperature packaging

Performance and reliability of bonded interfaces for high-temperature packaging

2018
Format: Electronic

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Cover image for Mechanical characterization study of sintered silver pastes bonded in a double-lap configuration

Mechanical characterization study of sintered silver pastes bonded in a double-lap configuration

by Paret, Paul
2018
Format: Electronic

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Cover image for Surrealism and modernism

Surrealism and modernism

2003
Format: Book

Location	Call #	Status
Joyner - General Stacks	N6494.M64 S87 2003	✔ Available