• Hours
  • Libraries & Collections
    • Joyner Library
    • Laupus Health Sciences Library
    • Music Library

    • Digital Collections
    • Special Collections
    • Teaching Resources Center
    • The ScholarShip Institutional Repository
    • Country Doctor Museum
  • Get Help
ECU Libraries Catalog
Browse
  • Call Number
  • Title
  • Author
  • Subject
  • Series
Advanced Search
Course Reserves
Suggest a Purchase
My Account
Find Materials By

Format

  • Electronic6

Library Location

  • Joyner Library6

Publication Date

  • Since 20201
  • 2010-20195

Call Number

    Collection

    • Joyner E-Resources6

    Language

    • English6

    Genre

    • Congresses3

    Era

      Region

      • United States5

      Search Results

      Start Over
      You searched for: author_facet DeVoto, Douglas Remove constraint
      Showing 1 - 6 of 6 results
      • Relevance
      • Year (Descending)
      • Year (Ascending)
      • Author (Ascending)
      • Author (Descending)
      • Title (Ascending)
      • Title (Descending)
      • 10 per page
      • 20 per page
      • 50 per page
      • 100 per page

      Search Results

      Cover image for Advanced power electronics designs - reliability and prognostics

      Advanced power electronics designs - reliability and prognostics

      • by DeVoto, Douglas
      • 2021
      • Format: Electronic
      Location
      Access Content Online
      Cover image for Performance and reliability of bonded interfaces for high-temperature packaging

      Performance and reliability of bonded interfaces for high-temperature packaging

      • by DeVoto, Douglas
      • 2014
      • Format: Electronic
      Location
      Access Content Online
      Cover image for Reliability of electrical interconnects

      Reliability of electrical interconnects

      • by DeVoto, Douglas
      • 2014
      • Format: Electronic
      Location
      Access Content Online
      Cover image for Thermal performance and reliability characterization of bonded interface materials (BIMs)

      Thermal performance and reliability characterization of bonded interface materials (BIMs)

      • by DeVoto, Douglas
      • 2014
      • Format: Electronic
      Location
      Access Content Online
      Cover image for Performance and reliability of bonded interfaces for high-temperature packaging

      Performance and reliability of bonded interfaces for high-temperature packaging

      • by DeVoto, Douglas
      • 2014
      • Format: Electronic
      Location
      Access Content Online
      Cover image for Thermal performance and reliability of bonded interfaces for power electronics packaging applications

      Thermal performance and reliability of bonded interfaces for power electronics packaging applications

      • by DeVoto, Douglas
      • 2011
      • Format: Electronic
      Location
      Access Content Online
      East Carolina University
      East Fifth Street | Greenville, NC 27858-4353 USA | 252.328.6131 | Contact Webmaster